The value of chip-package codesign is well established. Complex parts with high-speed signals put more constraints on the design of both IC and package, and careful design is required to achieve ...

LG Innotek’s “Dream Factory” in Gumi, North Gyeongsang Province, was in full operation on April 17, producing flip-chip ball grid arrays (FC-BGA), next-generation semiconductor substrates. These ...

Samsung Electro-Mechanics (Semco) has announced the development of FC-BGA substrates for advanced driver assistance systems (ADAS), as well as the expansion of its high-end automotive semiconductor ...

The Global Semiconductor Advanced Substrate Market was valued at USD 9293 Million in the year 2024 and is projected to reach a revised size of USD 14630 Million by 2031, growing at a CAGR of 6.8% ...

Ironwood Electronics’ Giga-snaP BGA socket adapter pair allows 0.5-mm-pitch, 11.5- by 13-mm, 14x14 array e-MMC modules housed in 153-ball BGAs to be socketed and subsequently operated without ...