SHANGHAI, March 16, 2021 /PRNewswire/ -- This week at SEMICON China, Advanced Micro-Fabrication Equipment Inc. China (AMEC) formally announced the Primo Twin-Star® system (Twin-Star) – a new addition ...
Backside Power Delivery is seen as one of the most important technologies for future IC process improvements. Intel says it will introduce the technology in products next year, TSMC says it will be ...
RC delay issues grow in the back-end-of-the-line over the next couple of process nodes; possible solutions include new materials, new processes and stacked die. It’s becoming apparent that traditional ...
Qualcomm outlined the technology challenges facing mobile chip suppliers at a recent event. In no particular order, the challenges include the usual suspects—area scaling, power reduction, performance ...
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