Jinman Han is President of Samsung Semiconductor, Inc. & leads the U.S. business, including Memory, Foundry, System LSI and LED. Almost every innovation introduced to the world has been touted as the ...
Average Al chip-package size to triple by 2030 for more memory and computing cores Advanced packaging is becoming a core driver of semiconductor performance and profitability as artificial ...
The chip manufacturing industry can be quite complex, and that’s normal. After all, there are multiple factors that go into the performance of a SoC, making it a success or directly ruining a good ...
TAYLOR, Texas (KBTX) - National, state and local leaders gathered in Taylor for an announcement about expanding computer chip manufacturing. This is a partnership between Samsung and national leaders ...
Taiwan Semiconductor Manufacturing (NYSE:TSM) is thinking of building advanced packaging capacity in Japan, Reuters reported people with knowledge of the matter. One option being evaluated by the ...
TL;DR: Apple is collaborating with TSMC to adopt advanced WMCM and SoIC packaging technologies for its next-generation A20 and server chips in 2026. These innovations enable ultra-dense chip stacking, ...
According to the latest report published by DIGITIMES Asia, global data center AI chip shipments are projected to grow from 30.5 million units in 2024 to 53.4 million units in 2030. This data center ...
Late last year, Apple CEO Tim Cook announced that the company would definitely be buying chips made at Taiwan Semiconductor’s new Arizona-based fab once it had opened. Apple working with TSMC isn’t ...
(Reuters) - A group of Chinese chip companies led by Huawei Technologies and backed by the country's government aims to produce high-bandwidth memory (HBM) semiconductors, a key component in AI chips ...
Some results have been hidden because they may be inaccessible to you
Show inaccessible results
Feedback