Researchers at Shanghai University have developed a physics-constrained, data-efficient artificial intelligence framework that enables accurate thermal field inversion in chiplet-based packaging ...

Chiplet Summit announces its fourth annual conference on February 17-19, 2026, at the Santa Clara Convention Center. The 2026 event will highlight the next wave of innovation in chiplet-based design ...

SANTA CLARA, Calif.--(BUSINESS WIRE)--Chiplet Summit, the premier global event focused on chiplet-based design and integration, will debut its Best of Show Awards at the 2026 event, taking place ...

Chiplet Summit today opened pre-registration for its fourth annual event, taking place February 17-19 at the Santa Clara Convention Center. Major chipmakers have all adopted chiplets for leading-edge ...

Collaboration on Development and Supply of Next-Generation AI Chiplet and Server Software Development and Verification by 2026; Large-Scale Mass Production Expected SEOUL, South Korea, July 28, 2025 ...

Chiplets—discrete semiconductor components co-designed and manufactured separately before being integrated into a larger system—are emerging as a groundbreaking approach to addressing many of the ...

Chiplet Summit, the premier global event focused on chiplet-based design and integration, has extended the nomination ...

A new technical paper titled “FoldedHexaTorus: An Inter-Chiplet Interconnect Topology for Chiplet-based Systems using Organic and Glass Substrates” was published by researchers at ETH Zurich. “Chiplet ...

3D IC chiplet-based heterogeneous package integration represents the next major evolution in semiconductor design. It allows us to continue scaling system performance despite the physical limitationA ...