San Jose, California — April 22, 2010 – Novellus Systems (NASDAQ: NVLS) announced today that it has developed precision anti-reflective layer (ARL) patterning films on its VECTOR PECVD platform with ...

The semiconductor industry's seemingly endless march to larger wafer sizes and ever-smaller critical dimensions in fulfillment of Moore's Law is an amazing phenomenon. Over the years, the challenge of ...

Via patterning at advanced nodes requires extremely low critical dimension (CD) values, typically below 30nm. Controlling these dimensions is a serious challenge, since there are many inherent sources ...

Higher density fan-out packages are moving toward more complex structures with finer routing layers, all of which requires more capable lithography equipment and other tools. The latest high-density ...