Detecting macro-defects early in the wafer processing flow is vital for yield and process improvement, and it is driving innovations in both inspection techniques and wafer test map analysis. At the ...
In semiconductor manufacturing, the chemical mechanical polishing (or CMP) step is used to planarize, or create a level topography, between each layer of the interconnect structure as the device is ...
Effective fabrication of complex, high performance semiconductor devices is highly dependent on the use of chemical mechanical planarization (CMP). This process is used to planarize the wafer surface ...
HSINCHU, Taiwan — September 10, 2008 — Rohm and Haas Electronic Materials (NYSE:ROH), CMP Technologies, a leader and innovator in chemical mechanical planarization (CMP) technology for the global ...
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