A new research paper titled “Impact of Stacking-Up and Scaling-Down Bit Cells in 3D NAND on Their Threshold Voltages” was published by researchers at Sungkyunkwan University and Korea University.

Check out more coverage of the 2022 Flash Memory Summit. Micron has started mass production of its most advanced triple-level-cell (TLC) 3D NAND chips made up of 232 layers of memory cells, pulling ...

3D NAND suppliers are accelerating their efforts to move to the next technology nodes in a race against growing competition, but all of these vendors are facing an assortment of new business, ...

Check out our coverage of the 2023 Flash Memory Summit. 3D NAND chips are the skyscrapers of the semiconductor industry, linking together layers of flash memory with short vertical interconnects that ...

To solidify its leading position in the NAND flash market, Samsung Electronics reportedly plans to again utilize a double-stack technology for manufacturing 3D NAND over 300 layers, aiming to surpass ...