With shrinking chip sizes, Wafer Level Packaging (WLP) is becoming an attractive packaging technology with many advantages in comparison to standard Ball Grid Array (BGA) packages. With the ...

With shrinking of chip sizes, Wafer Level Chip Scale Packaging (WLCSP) becomes an attractive and holistic packaging solutions with various advantages in comparison to conventional packages, such as ...

Semiconductor makers STMicroelectronics and Infineon have teamed with 3D packaging provider STATS ChipPAC to jointly develop the next generation of embedded Wafer-Level Ball Grid Array (eWLB) ...

STATS ChipPAC Ltd, a semiconductor test and packaging service provider, today announced it has ramped first-generation embedded wafer-level ball grid array (eWLB) technology to high-volume production.

STATS ChipPAC has shipped over one billion fan-out wafer level packages (FOWLP), also known in the industry as embedded wafer-level ball grid array (eWLB), according to the company. Save my User ID ...

Spreadtrum Communications has adopted STATS ChipPAC's embedded wafer-level ball grid array (eWLB) packaging solutions for a number of its mobile chipsets used mainly in smartphones sold in China, ...

MUNICH, Germany — Infineon has granted licenses for its eWLB chip packaging technology to competitor STMicroelectroncis as well as to Singapore-based packaging engineering company STATS ChipPAC. The ...