Asymmetries in wafer map defects are usually treated as random production hardware defects. For example, asymmetric wafer defects can be caused by particles inadvertently deposited on a wafer during ...

within-sample variation (for example, position within wafer) sample-to-sample variation within batches of samples (for example, wafer within lot) batch-to-batch variation (for example, across lots) ...

Detecting macro-defects early in the wafer processing flow is vital for yield and process improvement, and it is driving innovations in both inspection techniques and wafer test map analysis. At the ...

Modern-day high-volume semiconductor manufacturing is a complex process that spans numerous stages and nodes. And with the ever increased focus on quality and cost, the manufacturing supply chain is ...

Known-good-die (KGD) sort is a commonly used technique in semiconductor processing that allows IC device engineers to bypass the packaging of defective semiconductor devices, saving time and money.