Walk into a typical data center and one of the first things that jumps out at you is the noise—the low, buzzing sound of thousands of fans: fans next to individual computer chips, fans on the back ...

Data center rack density has risen rapidly in recent years. Operators are cramming more computing power into each server rack to meet the needs of AI and other high-performance computing applications.

Tokyo, Japan – The exponential miniaturization of electronic chips over time, described by Moore's law, has played a key role in our digital age. However, the operating power of small electronic ...

A new technique for fabricating liquid cooling channels onto the backs of high-performance integrated circuits could allow denser packaging of chips while providing better temperature control and ...

Emails and other communications sent between Microsoft employees are literally making liquid boil inside a steel holding tank packed with computer servers at this datacenter on the eastern bank of the ...

Leuven, Belgium. imec today announced that it has demonstrated for the first time a low-cost impingement-based solution for cooling chips at package level. The organization said this achievement is an ...