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SK hynix announces 321-layer, UFS 4.1 chips — TLC 4D NAND set to land in PCs and data centers
Leading memory maker SK hynix today announced it has developed a UFS 4.1 storage solution built upon its 321-layer 4D NAND flash. The super dense NAND chips which will power these UFS 4.1 ICs are ...
SK Hynix Inc. (or "the company") announced today that it has developed a UFS 4.1 solution product adopting the world's highest 321-layer 1Tb triple-level cell 4D NAND flash for mobile applications.
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