New process technology and microarchitectural enhancements will, as always, play an important role. But increasingly, the industry is looking toward a concept known as heterogeneous computing to save ...

For its APUs, AMD pulled together CPU technology based on the x86 standard developed by both AMD and Intel and GPU technology based on intellectual property acquired when it bought Canadian graphics ...

Semiconductor Engineering sat down with Paul Chou, senior director of security architecture at NVIDIA, to discuss data leakage in heterogeneous designs. What follows are excerpts of that one-on-one ...

Heterogeneous computing systems integrate diverse processing elements—including central processing units (CPUs), graphics processing units (GPUs) and field-programmable gate arrays (FPGAs)—within a ...

AMD wants to talk about HSA, Heterogeneous Systems Architecture (HSA), its vision for the future of system architectures. To that end, it held a press conference last week to discuss what it’s calling ...

At The Next FPGA Platform event in San Jose, California on January 22, Jose Alvarez, Intel PSG CTO, Jose Alvarez outlined the three levels of heterogeneous integration. It’s a simple taxonomy. First, ...

Do I patch my system in the name of security, or do I leave it unpatched to enable critical operations and business functions? Heeding CIO or CISO advice to patch systems and update information ...

AMD’s Heterogeneous System Architecture (HSA) is a hardware framework that provides Heterogeneous Uniform Memory Access (HUMA) to CPUs and GPUs. The reason for putting it in the software category is ...

The drive toward exascale computing is giving researchers the largest HPC systems ever built, yet key bottlenecks persist: More memory to accommodate larger datasets, persistent memory for storing ...

Complex homogeneous systems are common in server environments that use symmetrical multiprocessing (SMP) or clusters of similar platforms. Yet complex embedded systems frequently incorporate different ...

Accurate and efficient thermal modeling for 2.5D/3D heterogeneous chiplet systems” was published by researchers at EPFL and ...