3D-ICs are proving a challenge even for designers accustomed to dealing with power and performance tradeoffs, but they are considered an inevitable migration path for leading-edge designs due to the ...
Multi-die assemblies are becoming more common and more complex due to technology advancements and market demands, but differing die dimensions are making this process increasingly challenging. To ...
Some results have been hidden because they may be inaccessible to you
Show inaccessible results
Feedback