TweakTown

Intel's new 3D Foveros packaging tech: LEGO-like chiplets for CPUs

Use left and right arrow keys to seek audio. Intel has revealed more details on its upcoming 3D Foveros packaging technology, which it will be using to built its next-gen Meteor Lake, Arrow Lake, and ...
ExtremeTech

Intel's 288-Core Clearwater Forest Xeon CPU to Utilize Foveros 3D Stacking: Report

Now that it's 2024, Intel's "five nodes in four years" strategy will start picking up steam. The company has multiple CPUs on new processes lined up for launch this year for client and server. Now ...
TweakTown

Intel's next-gen Xeon 'Clearwater Forest' CPUs rumored with 3D stacking with hybrid bonding

Use left and right arrow keys to seek audio. Intel's next-gen Xeon "Clearwater Forest" CPUs will feature up to 288 cores based on the new Darkmont CPU architecture, with no P-Cores in sight with ...
HotHardware

Intel Details Ambitious Chip Fab Roadmap With Cutting-Edge RibbonFET, PowerVia And Foveros Tech

The ‘Intel Accelerated' webcast kicked off today, hosted by newly-minted CEO Pat Gelsinger and Dr. Ann Kelleher, SVP and general manager of Technology Development. The dynamic duo disclosed a number ...
Neowin

Here is Intel's architecture roadmap for 2025 and beyond0 0

Intel has detailed its architecture roadmap up until 2025 and beyond. It features a new node naming strategy, a transistor architecture, and packaging enhancements under the IDM 2.0 model. At its ...