In recent years, advanced packaging has become much more important. While semiconductor manufacturers used to focus primarily on miniaturization and increasing the performance of individual chips, the ...

At SEMICON Taiwan 2025, AMD Fellow Daniel Ng, who heads the company's OSAT technology development, laid out a stark assessment of the semiconductor industry's next bottleneck: the energy cost of ...

Nvidia’s CEO Jensen Huang has made waves by saying that his company’s most advanced artificial intelligence (AI) chip, Blackwell, will transition from CowoS-S to CoWoS-L advanced packaging technology.

TL;DR: TSMC is advancing silicon photonics with co-packaged optics (CPO) samples for NVIDIA and Broadcom by 2025, achieving 1.6 terabits-per-second speeds. The technology integrates microring ...

REHOVOT, Israel, Aug. 26, 2025 /PRNewswire/ -- Nova (NASDAQ: NVMI), today announced the release of its latest optical metrology solution, the Nova WMC. This next-generation modular platform has been ...

New research has shown how the quantum mechanical principle of strong coupling opens unrivalled possibilities for designing optical filters. A team of researchers from the University of Cologne, ...

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GlobalFoundries and Corning are developing detachable fiber connector mechanisms for the former’s silicon photonic platform that taps the latter’s work in optical fiber technology, with the joint ...

How data centers are evolving to meet the challenges of AI/ML computing. Pros and cons of common copper and optical interconnect solutions. Benefits of RF transmission over plastic cable (e-Tube) for ...