As Micro-LED displays and advanced semiconductor components push the limits of miniaturization and efficiency, precision and scalability in manufacturing become critical. The technology-leading ...

Several years ago, many predicted the demise of an older interconnect packaging technology called wire bonding, prompting the need for more advanced packaging types. Those predictions were wrong. The ...

As competition in high bandwidth memory (HBM) to boost artificial intelligence (AI) semiconductor performance intensifies, the core task has shifted from how small to make memory to how precisely to ...

Samsung Electronics is actively enhancing its semiconductor foundry capabilities by embracing hybrid bonding technology. The company has recently integrated equipment from BE Semiconductor Industries ...

BOSTON, Sept. 15, 2023 /PRNewswire/ -- Bumping technologies for advanced semiconductor packaging have evolved significantly to address the challenges posed by shrinking contact pitches and the ...

(MENAFN- GetNews) What is the function of form fill seal machine? In today's fast-paced life, the production and packaging industries are growing stronger and stronger to meet people's growing ...

Samsung Electronics is not only investing actively in the R&D and capacity expansion of high-bandwidth memory (HBM) technology, but also looking to broaden its market reach through customized one-stop ...