In order to facilitate model-based design, developers need a way to distribute protected design models for simulation. The primary solutions in use today are model encryption, model compilation, and ...

Digital twins dominated discussions at SEMICON West this year, appearing in keynote presentations, panel sessions, and workshops. The conversation reflected a noticeable shift in how the industry ...

For many applications, next generation IC packaging is the best path to achieve silicon scaling, functional density, and heterogeneous integration while reducing the overall package size.