Experts at the Table: Semiconductor Engineering sat down to discuss reliability of chips, how it is changing, and where the new challenges are, with Steve Pateras, vice president of marketing and ...
In the era of megatrends such as electric vehicles (EVs), new technologies are emerging to keep up with evolving demands. One example of this is the evolution of compound semiconductors that use ...
Performance of InnoSwitch™3-AQ flyback IC demonstrated in new reference designs featuring wide-creepage package “The new InSOP™-28G package, with its wide 5.1 mm drain-to-source pin creepage distance, ...
Design engineers are increasingly turning to 3D ICs to keep pace with the ascent of next-generation AI scaling.
Marek Hytha, Atomera Chief Scientist, will present research on Mears Silicon Technology™ (MST®) — technology that enhances the performance of silicon-based semiconductor devices by inserting ...
Performance of InnoSwitch™3-AQ flyback IC demonstrated in new reference designs featuring wide-creepage package The InnoSwitch3-AQ IC, featuring a 1700 V silicon-carbide (SiC) switch, is an ideal ...
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