Researchers and industries have been using transmission electron microscopy (TEM) to study semiconductors' stacking and dislocation faults. This article considers the analysis of crystal structures.

Several vendors are rolling out next-generation inspection systems and software that locates problematic defects in chips caused by processes in extreme ultraviolet (EUV) lithography. Each defect ...

Silicon carbide (SiC) is a crystalline material utilized to develop a wide array of electronic devices, including transistors and other high-power, high-frequency, and high-temperature devices. As ...

Several companies are developing or shipping next-generation e-beam inspection systems in an effort to reduce defects in advanced logic and memory chips. Vendors are taking two approaches with these ...