Thanks to advances in circuit miniaturization and systemin- package (SiP) technology, the goals of smaller size and more functionality have become attainable. Thanks to advances in circuit ...

Path to Systems - No 3: This article provides insights into how the design and manufacturing process of system-in-package technology will extend Moore’s vision, creating Moore’s law 2.0.

Using a system-in-package (SiP) rather than system-on-chip (SoC) implementation to address product miniaturization requirements can lead to shorter development cycles with minimal capital investment.

SiPFLOW(TM) Platform Enables Low-Cost, Reliable SiPs for Media-Rich Applications SAN JOSE, CA -- Nov. 10, 2005-- Inapac Technology, Inc., a provider of intellectual property (IP) and services to ...

Nan Ya PCB has delivered samples of SiP substrates for processing 5nm chips for validations by clients and expects to kick off shipments of such substrates by the end of 2020 at the earliest, which ...