Fujifilm announced its plan to strengthen its business in materials for semiconductor back-end processes at a semiconductor materials business briefing held in Tokyo on July 15, 2025. The company aims ...

Nikon has announced plans to launch exposure equipment for the back-end semiconductor process in fiscal year 2026 (April 2026 to March 2027), utilizing a photomask-free approach, in its first venture ...

AI Nose deployment into front-end wafer fabrication facilities marks a critical validation step in semiconductor ...

Trio-Tech International (NYSE MKT: TRT), a comprehensive provider of semiconductor back-end solutions and a global value-added supplier of electronic equipment, today announced it has received orders ...

Sunfort™ dry film photoresist is a mainstay of Asahi Kasei’s Electronics business, comprising electronic materials and components. The entity is positioned as a First Priority business to drive growth ...

Resonac is looking for development partners to establish a new debonding process, as well as to market the new temporary bonding film. In the front-end and back-end processes of advanced ...

TOKYO, Oct. 1, 2025 /PRNewswire/ -- Nikon Corporation is reaffirming the availability of its Digital Lithography System, DSP-100, with orders having commenced in July 2025. This system is specifically ...

TL;DR: Samsung Electronics has begun developing its next-generation 1nm process node, termed the "dream semiconductor process," requiring new technologies and High-NA EUV lithography. Mass production ...

HOUSTON, TX / ACCESS Newswire / January 7, 2026 / Ainos, Inc. (NASDAQ:AIMD)(NASDAQ:AIMDW), a SmellTech platform company digitizing scent as a native data language for artificial intelligence, today ...

The DSP-100 integrates Nikon's high-resolution semiconductor lithography technology with the multi-lens technology* 4 from its flat panel display (FPD) lithography systems. It delivers high resolution ...