An extensive range of insulating thin films are utilized in modern VLSI circuits providing electrical isolation between conducting regions within a device and as a final capping passivation layer.
Various thin-film deposition tools, including PVD (e-beam & thermal evaporators, DC & RF magnetron (reactive) sputterers) and CVD (APCVD of graphene, Si oxidation, PECVD of SiO2 and SiNx). Available ...
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