Catching all defects in chip packaging is becoming more difficult, requiring a mix of electrical tests, metrology screening, and various types of inspection. And the more critical the application for ...

In our previous article on Ball Grid Arrays (BGAs), we explored how to design circuit boards and how to route the signals coming out of a BGA package. But designing a board is one thing – soldering ...

Optimizing speed and time are not only the ingredients to fulfill gold medal aspirations on the Olympic track, but the prerequisites to a robust surface mount (SMT) process of memory to bottom (logic) ...

Package equipment sensors, newer inspection techniques, and analytics enable quality and yield improvement, but all of those will require a bigger investment on the part of assembly houses. That’s ...

In BGA chip packages, it is the tiny globe of solder that provides the contact between the chip package and the printed circuit board. Also called a "solder bump." See BGA. THIS DEFINITION IS FOR ...

Memory module makers often use X-ray technology to inspect samples taken from a manufactured batch for abnormal soldering joints. BGA connections are not easily accessible from all sides and as a ...

Simple and inexpensive semiconductor devices in earlier generations of electronic systems were easily discarded or recycled when they were damaged either before or during the printed circuit board ...

Xradia's VersaXRM™ 3D X-ray microscope enables high resolution imaging of bump cracks and voids down to submicron levels, even for large packages without any sample preparation. As the complexity of ...

X-ray and advanced automated techniques combine to create a capable tool for lead-free solder inspection needs. Within two years, solder used in electronics manufactured or sold in Europe must meet ...

Tombstoning is a defect where a two-leaded, wrap-around lead-style termination chip component fails to lay down appropriately and allow solder to simultaneously make a required electrical/mechanical ...