Electronic packaging has continued to become more complex with higher device count, higher power densities and Heterogeneous Integration (HI) becoming more common. In the mobile space, systems that ...
Failure to sufficiently cool an electronic component will lead to overheating, which can reduce its lifespan or even permanently damage the product’s internal system. Selecting a cooling method for ...
It’s costly and time-consuming to determine the causes of hotspots on circuit boards, and to attempt to arrive at a “well-tempered” board through multiple iterations once a prototype is approved. A ...
Placing multiple chips into a package side-by-side can alleviate thermal issues, but as companies dive further into die stacking and denser packaging to boost performance and reduce power, they are ...
Fabric might be the last thing on your mind when firefighters rescue someone from a burning building, but without fire-resistant clothing, such rescues might not happen at all. The turnout gear that ...
SAN JOSE, Calif.--(BUSINESS WIRE)--TDK Corporation (TSE: 6762) announced today that subsidiary TDK Ventures, Inc. has invested in thermal interface solution innovator NovoLINC, a Pittsburgh, ...
TOKYO--(BUSINESS WIRE)-- Shin-Etsu Chemical Co., Ltd., (Head Office: Tokyo, President: Yasuhiko Saitoh) has newly developed thermal interface silicone rubber sheet, the “TC-BGI Series,” for ...
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