Things are moving really fast at the moment as this year, we see both Fan-out wafer level packaging and chip embedding into PCB laminate infrastructures emerging at the same time, ramping to high ...
Historically, embedded IC package technology is not new at all: several players such as Freescale with its RCP, Infineon with its eWLB and Ibiden for die embedding into PCB laminated substrates have ...
Using a wafer-level package (WLP) can reduce the overall size and cost of your solution. However when using a WLP IC, the printed circuit board (PCB) layout can become more complex and, if not ...
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